ky-凯发真人

ky-hgs 6310 thermal conductivity potting adhesive is a medium and low viscosity additive silicone potting adhesive with excellent fluidity and stability. after mixing, it can be cured at room temperature or heated, with the higher the temperature, the faster the curing speed; this series of products in the curing reaction process does not produce any by-products, minimal shrinkage, with repairability, can be deeply cured into elastomers. in a wide range of temperature and humidity changes, it can reliably protect sensitive circuits and components for a long time, with excellent electrical insulation performance, can resist environmental pollution, avoid damage caused by environmental factors such as stress and vibration and humidity. this series of products has excellent physical and chemical resistance.