k-凯发真人

k-hc 900e is a universal thermal gasket that can meet the heat dissipation requirements without special hardness requirements, and its softness can meet most pressure assembly requirements, showing small thermal resistance, while eliminating air between components and circuit boards, and fully filling all kinds of rough surfaces. the product comes with its own stickiness. the default is no substrate structure, and can be customized to have a substrate structure, such as backsilicon tape /3m glue/glass fiber and other processes to meet special requirements.