k-凯发真人

k-hc5200e is a non substrate thermal conductive silicone pad with enhanced tensile and tear resistance. it has low density, excellent electrical insulation performance, aging resistance, hydrophobic shock absorption, high and low temperature resistance, and good adhesion. it is specially customized for the heat dissipation requirements of automotive new energy power battery modules, fully filling various rough surfaces. this product comes with adhesive properties. no need for adhesive backing to meet assembly and bonding requirements, high elasticity ensures repeated bonding during the assembly process without deformation.